StencilQuik™ has been honored with the coveted Vision Award for 2004 Product of the Year under the Rework Products category.
Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in and around the BGA area being reworked? Do want to insure that a reliable rework process is used that subjects the BGA to a minimal number of heat excusions? We have an answer to your frustrations------ StencilQuik™. This breakthrough method allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.CSPs.
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1. Prepare site.

2. Align and affix the StencilQuik
onto the PCB.

3. Squeege paste or apply flux into the apertures on the RCB.

4. Simply align and place part and reflow.
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These stencils are laser cut from high quality, anti-static polyimide film with a residue-free high temperature adhesive backing. The StencilQuik™ apertures correspond to the land patterns on the PCB and define those portions of the PCB which are to have paste or paste flux applied.
StencilQuik™s are packaged in groups of (10) in a small antistatic poly bag. Squeegees are sold separately. |