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GF-B Batch Oven
This unique shuttle system enables a higher
throughput than standard batch ovens. Both sides
of the oven have a cooling station, and while one
board is being processed, another board can be
cooled and offloaded, then a third board can be
loaded and shuttled into the chamber for reflow.
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Features
- Lead Free Soldering capability (GF-B-HT model) Max. Temp. 315° C (600° F)
- 100% forced air convection
- Individual time and temperature microprocessor controls make profile set-up easy
- All stainless steel interior construction
- Unique shuttle system enables higher throughputs than standard batch ovens
- CE compliant
- Dual cooling zones
- Processes boards up to 12" x 12"
- Large viewing window on top enables viewing of entire reflow process
- N2 inerting option available (Model GF-BN)
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Specifications
| Configuration |
3 bottom heating elements (2 cyclonics) |
| Electrical Power |
20A @ 220 VAC, 50/60 Hz, 1Ø, 2.7 kW |
| Cooling Zones |
2 |
| Max Board Width |
12" (305mm) |
| Venting |
exhaust fan with 4" flange |
| Overall Dimensions |
37" x 28 1/4" x 14 1/2" (940 x 715 x 368mm) |
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