BGA/CSP Rework
TF-1700 [More Information]
PACE’s ThermoFlo Systems (TF 1700 & TF 2700) are the next generation in automated, cost effective solutions for area array package rework. No other systems on the market have the advanced features found on these systems or is easier to use, ensuring operator acceptance and success! Designed for today’s PCBs, ThermoFlo Rework Systems can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, and other SMDs.
TF-2700 [More Information]
PACE’s ThermoFlo Systems (TF 1700 & TF 2700) are the next generation in automated, cost effective solutions for area array package rework. No other systems on the market have the advanced features found on these systems or is easier to use, ensuring operator acceptance and success! Designed for today’s PCBs, ThermoFlo Rework Systems can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, and other SMDs.
XR-3000 [More Information]
The XR 3000 is ideal for inspecting BGAs, CSPs, and other electronic components. The XR 3000 provides immediate feedback on your process using real-time images. Images can be viewed through the ThermoFlo 3000 software or through an optional, flat screen, LCD monitor when used as a standalone unit.
Consumables [More information]
A range of nozzle for all BGA/CSP applications